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Non Conductive Pastes, Films & Wafer coatings

Die Attach materials for Leadframe and Laminate packaging

AVAILABLE DIRECTLY AT CAPLINQ.COM

Non Conductive Pastes, Films & Wafer coatings

Addressing the requirements for both laminate and leadframe wirebond packages, Henkel has developed a comprehensive portfolio of advanced non-conductive die attach materials for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. With high-reliability at the forefront, LOCTITE ABLESTIK non-conductive die attach materials are capable of producing devices that meet stringent JEDEC MSL1 standards.


Laminate Packaging Materials

A broad selection of non-conductive LOCTITE ABLESTIK die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to Smart Cards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as Bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.

Leadframe Packaging Materials

Process flexibility and superior performance underscore Henkel’s complete portfolio of die attach pastes for leadframe devices. Incorporated into applications such as automotive electronics, where temperature control and unfailing function are critical, LOCTITE ABLESTIK die attach pastes deliver excellent electrical insulation and high reliability. Robust adhesion to various metal surfaces including palladium, copper, silver, gold and PPF along with proven low-bleed formulas make Henkel’s die attach materials the products of choice for leadframe packaging specialists

Non Conductive Wafer Backside Coatings

Wafer Backside Coating is a unique process that facilitates automated application of die attach adhesive at the wafer-level followed by B-staging to form a die attach film. Applied by spray coating, Henkel’s Wafer Backside Coatings enable process speed, thickness control and material uniformity. Following thermal or UV B-staging and wafer dicing, die attach is achieved via heat and pressure to produce a consistent bond line and small, controlled fillets. Wafer Backside Coating adhesives are ideal for die attach applications where fillet control is critical.

Henkel’s novel Wafer Backside Coating materials allow for screen or stencil printing of the paste across the entire wafer in a single stroke, increasing throughput by eliminating the need to individually dispense dots of adhesive. After B-staging to create a film, Wafer Backside Coating provides consistent bond lines and small, controlled fillets, which are particularly effective for attaching small die in miniaturized packages and challenging structures like chip-on-lead, where the die pad is smaller than the die.

Compare Products
3 products
  • Loctite Ablestik 2025D
    Catalog Product

    Loctite Ablestik 2025D

    • Excellent dispense capabilities
    • Minimum bleed
    • 260ºC reflow capability for Pb-free applications
    • 8 weeks
  • Loctite Ablestik 8910T
    Catalog Product

    Loctite Ablestik 8910T

    • High MRT performance
    • High thermal conductivity
    • BMI Hybrid
    • 8 weeks
  • Loctite Ablestik 2033SC
    Catalog Product

    Loctite Ablestik 2033SC

    • Low cure temperature
    • Single component
    • Optimized rheology
    • 8 weeks
Compare Products
3 products

Product Selector Guide

Non-Conductive Die Attach Film
Product Description Key attributes
Dicing tape Film tickness (um) Wafer thickness (um) Moisture sensitivity level, MSL Modulus at 25°C (MPa)
Loctite Ablestik ATB 100 Series
Silica-filled, rubberized epoxy die attach adhesive - Compatible with Cu wire or Au wire packages
- Good adhesion onto low density fiberboard (LDF)
- Compatible with with stealth dicing before grind (SDBG) process
- Oven cure
Non-UV 15, 20, 25 or 30 Up to 75 L2 260 °C Capable 1,170
Loctite Ablestik ATB 100HA Series Silica-filled, epoxy die attach adhesive - Consistent dicing and die pickup for large die applications
- Compatible with stealth dicing before grind (SDBG) process
- SkipCure
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L1 260 °C Capable 2,299
Loctite Ablestik ATB 100U Series Silica-filled, rubberized epoxy die attach adhesive - Compatible with CU wire or Au wire packages
- Compatible with sealth dicing before grind (SDBG) process
- Fast oven cure
Non-UV 5, 10, 15, 20, 25 or 30 Up to 75 L2 260 °C Capable 875
Loctite Ablestik ATB 100US Series Silica-filled, epoxy die attach adhesive - Long thermal budget (4 hr.at 175 °C)
- Consistent dicing and die pickup for large die applications
- SkipCure during molding process
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L2 260 °C Capable 1,277
Loctite Ablestik ATB F100E Series Silica-filled, epoxy die attach adhesive - Suitable for small to large die
- Excellent workability for below 3mm x 3mm die
- Long work life (4 months before and after lamination
- Compatible with stealth dicing before grind (SDBG) process
- Film over wire (FoW) and film over die (FoD) applications
- Oven cure
UV/Non-UV 25
FoW: 35 – 80
FoD: 90 – 150
Up to 75 L1 260 °C Capable 5,256
Electrically Non-Conductive Die Attach Paste (DAP) Adhesives
Product Description Key attributes
Die size (mm) Substrate finish Moisture sensitivity level, MSL Modulus at 25°C (MPa) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 2025D
Silica-filled, die attach adhesive - Low bleed
- Very low stress
- Red color for vision recognition
- Oven cure
<8X8 Cu, Ag or Au L3 260°C capable 407 0.4 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 8900NCM PTFE-filled, epoxy die attach adhesive - Low bleed
- Low voiding
- Moderately stress absorbing
- Excellent dispense capability
- Contains no category 3 carcinogenic, mutagenic or reprotoxic (CMR) substances
- Oven cure
<8X8 Pd, Cu, Ag or PPF L3 260°C capable 680 0.3 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik ABP 8611 BMI Hybrid die attach adhesive - Excellent dielectric properties
- Suitable for Cu wire or Au wire bonding
- High modulus at high temperatures
- Oven cure
<2X2 Cu, Ag or PPF L3 260°C capable 5,000 0.7 30 min. ramp and 60 min. hold at 175
°C
Loctite Ablestik ABP 8910T Alumina-filled, BMI hybrid die attach adhesive - Medium modulus
- High reliability
- Oven cure
<8X8 Cu, Ag or PPF L3 260°C capable 8,870 3.1 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik QMI536NB PTFE-filled BMI die attach adhesive - Low bleed
- Very low stress
- White color for vision recognition
- Widely used for stacked die
- Fast oven cure
<8X8 Cu, Ag or PPF L3 260°C capable 300 0.3 30 min. ramp 150°C
Electrically Non-Conductive Dicing Die Attach Film (DDF) Adhesives
Product Description Key attributes Dicing tape Film thickness (um) Wafer thickness (um) Moisture sensitivity level, MSL Modulus at 25°C (MPa)
Loctite Ablestik ATB 100 Series
Silica-filled, rubberized epoxy die attach adhesive - Compatible with Cu wire or Au wire packages
- Excellent wetting
- Compatible with stealth dicing before grind (SDBG) process
- Oven cure
Non-UV 15, 20, 25 or 30 Up to 75 L2 260°C capable 1,170
Loctite Ablestik ATB 100HA Series Silica-filled, epoxy die attach adhesive
- Consistent dicing and die pickup for large die applications
- No passivation damage
- Compatible with stealth dicing before grind (SDBG) process
- SkipCure
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L1 260°C capable 2,299
Loctite Ablestik ATB 100U Series Silica-filled, rubberized epoxy die attach adhesive
- Compatible with Cu wire or Au wire packages
- No passivation damage
- Compatible with stealth dicing before grind (SDBG) process
- Fast oven cure
Non-UV 5, 10, 15, 20, 25 or 30 Up to 75 L2 260°C capable 875
Loctite Ablestik ATB 100US Series Silica-filled, epoxy die attach adhesive - Consistent dicing and die pickup for large die applications
- No passivation damage
- Long thermal budget (4 hr. at 175°C)
- Oven cure
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L2 260°C capable 1,277
Loctite Ablestik ATB F100E Series Silica-filled, epoxy die attach adhesive - Suitable for small to large die
- Excellent workability for below 3mmX3mm die
- Long work life (4 months before and after lamination)
- Compatible with stealth dicing before grind (SDBG) process
- Film over wire (FoW) and film over die (FoD) applications
- Oven cure
UV/Non-UV 25
FoW: 35-80
FoD: 90-
150
Up to 75 L1 260°C capable 5,256
Electrically Non-Conductive Wafer Backside Coating (WBC) Adhesives
Product Description Key attributes
Die size (mm) Substrate finish Moisture sensitivity level, MSL Modulus at 25°C (MPa) CTE (ppm/°C)
Below Tg
Above T g
Recommended cure
Loctite Ablestik 8006NS Alumina/silica-filled, epoxy die attach wafer backside coating adhesive - Applied by stencil or screen printing
- Consistent bondline down to 25 um
- Oven B-stage and oven cure
<4X4 Cu, Ag or PPF L1 260°C capable 4,376 33
136
2 hr. at 160°C
Loctite Ablestik WBC 8901UV Die attach wafer backside coating adhesive
- Wide process windows
- 5 to 60 um bondline control
- Low viscosity before B-stage
- Can be spray coated on dicing before grinding (DBG) wafers
- UV B-stage oven cure
<1X1 Cu, Ag or PPF L2 260°C capable 3,585 45
142
15 min. ramp and 30 min. hold at 90°C +4 min. ramp and 45 min. hold at 120°C

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