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Electrically Conductive Pastes, Films & Wafers

Die Attach materials for Leadframe and Laminate packaging

AVAILABLE DIRECTLY AT CAPLINQ.COM

Electrically Conductive Pastes, Films & Wafer coatings

Addressing the requirements for both laminate and leadframe wirebond packages, Henkel has developed a comprehensive portfolio of advanced conductive die attach materials for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. As the market share leader and top innovator of the most advanced die attach solutions, Henkel’s LOCTITE ABLESTIK portfolio delivers exceptional die packaging reliability performance and meets the highest JEDEC MSL standards.


Laminate Packaging Materials

A broad selection of electrically conductive LOCTITE ABLESTIK conductive die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to Smart Cards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel conductive die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as Bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.

 

Leadframe Packaging Materials

Process flexibility and superior performance underscore Henkel’s complete portfolio of conductive die attach pastes for leadframe devices. Incorporated into applications such as automotive electronics, where temperature control and unfailing function are critical, LOCTITE ABLESTIK die attach pastes deliver high thermal conductivity and high reliability. Robust adhesion to various metal surfaces including palladium, copper, silver, gold and PPF along with proven low-bleed formulas make Henkel’s die attach materials the products of choice for leadframe packaging specialists

 

Conductive Wafer Backside Coatings

Henkel’s novel Wafer Backside Coating materials allow for screen or stencil printing of the paste across the entire wafer in a single stroke, increasing throughput by eliminating the need to individually dispense dots of adhesive. After B-staging to create a film, Wafer Backside Coating provides consistent bond lines and small, controlled fillets, which are particularly effective for attaching small die in miniaturized packages and challenging structures like chip-on-lead, where the die pad is smaller than the die.

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Product Selector Guide

Conductive Die Attach Pastes
Product Description Key attributes Die size Substrate finish Moisture sensitivity level, MSL Volume resistivity (Ohm-cm) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 2000 Ag-filled die attach adhesive - Low bleed
- Low stress
- Ultra-low moisture absorption
- Fast oven cure with no voids
<12X12 Solder mask or Au L2 260°C Capable 5.0X10-4 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2100A Ag-filled die attach adhesive - Low bleed
- Low stress
- Oven cure
<12X12 Solder mask or Au L2 260 °C Capable 5.0X10-2 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2300 Ag-filled die attach adhesive - Low bleed
- Low stress
- Excellent dispensability
- Low voiding
- Oven cure
<8x8 Solder mask or Au L2 260 °C Capable 5.0X10-2 0.6 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2700HT Ag-filled die attach adhesive - Excellent bleed performance
- Long work life
- Strong hot/wet adhesion to Au
- Ideal for small needle dispensing
- Oven cure
<8X8 Solder mask, Ag or Au L3 260 °C Capable 3.0X10-5 11.0 30 min. ramp and 30 min. hold at 175°C in nitrogen
Loctite Ablestik ABP 2030SCR Ag-filled die attach adhesive - Low stress
- Compatible with dam & fill encapsulates
- Excellent dispensing performance for high throughput application
- Snap cure
<8X8 Solder mask, Ag, Au or plastics L3 260 °C Capable 2.0X10-4 2.0 120 sec. at 120°C
Loctite Ablestik ABP 2032S Ag-filled, epoxy die attach adhesive - Good adhesion to a variety of substrates
- Good dispensing
- Low temperature oven cure
<10X10 Solder mask, Ag, Au, steel or plastics L3 260 °C Capable 2.0X10-4 1.0 60 min. at 80°C
 
Electrically Conductive Die Attach Films (CDAF)
Product Description Key attributes Film tickness (um) Moisture sensitivity level, MSL Thermal conductivity (W/m-k) In-package thermal resistance (K/W)
Loctite Ablestik CDF 600P series Ag-filled die attach adhesive - Low stress and excellent wetting for large die
- Compatible with various metal surfaces, including solder
- Recommended for thin wafer handling applications
- Oven cure
25 L2 260°C Capable 1 2.1
 
Wafer Back Coating Die Attach Product Selector
Product Description Key attributes Die size (mm) Substrate finish moisture sensitivity level, MSL Modulus at 25°C (MPa) CTE (ppm/°C)
below T g
Above Tg Recommended cure
Loctite Ablestik WBC 8901UV Die attach wafer backside coating adhesive - Wide process windows
- 5 to 60 um bondline control
- Low viscosity before B-stage
- Can be spray coated on dicing before grinding (DBG) wafers
- UV B-stage and oven cure
<1X1 Solder mask, Cu, Ag or Au L2 260°C capable 3585 45 142 15 min. ramp and 30 min. hold at 90°C + 4 min. ramp and 45 min. hold at 120°C
Electrically conductive die attach paste (DAP) adhesives
Product Description Key attributes Die size (mm) Substrate finish Moisture sensitivity level, MSL Volume resistivity (Ohm-cm) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 3230 Ag-filled, epoxy die attach adhesive - Low stress
- Excellent adhesion to Cu
- Oven cure
<8X8 Cu or Ag L3 260°C capable 5.0X10 -2 0.6 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 3290P Ag-filled, epoxy die attach adhesive - Medium modulus
- Low outgassing
- High reliability
- Snap or oven cure
<5X5 Cu, Ag or PPF L2 260°C capable 2.0X10 -2 0.8 180 sec. to peak 240°C (snap)
Loctite Ablestik 8200TI Ag-filled, die attach adhesive - No bleed
- Excellent adhesion to pre-plated finishes (PPF)
- Oven or snap cure
<5X5 Cu, Ag, PPF or Au L1 260°C capable 5.0X10 -5 3.5 180 sec. to peak 220
°C (snap)
Loctite Ablestik 8290 Ag-filled, epoxy die attach adhesive - Low stress
- Low bleed
- Excellent adhesion to Cu
- Oven cure
<5X5 Cu, Ag, PPF or Au L3 260°C capable 8.0X10 -3 1.6 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 8302 Ag-filled, die attach adhesive - Low stress
- Excellent hot/wet adhesion
- Excellent peel strength
- low moisture absorption
- Oven cure
<8X8 Cu, Ag or PPF L1 260°C capable 1.0X10 -4 0.8 30 min. ramp and 60 min. hold at 175°C
Loctite Ablestik 8352L Ag-filled, die attach adhesive - Low stress
- Minimal voiding
- Good bleed performance
- Good adhesion to multiple metal surfaces
- Oven cure or snap
<8X8 Cu, Ag, PPF or Au L2 260°C capable 5.0X10 -5 5.5 120 sec. to peak 220°C (snap)
Loctite Ablestik 8390 Ag-filled, epoxy die attach adhesive - Low stress
- Low condensable volatiles
- Moderately stress absorbing
- Excellent dispensability
- In-line oven snap cure or oven cure
<5X5 Pd or Ag L3 260°C capable 8.0X10 -4 1.8 80 sec. to peak 220°C (snap)
Loctite Ablestik 84-1LMISR4 Ag-filled, epoxy die attach adhesive - Excellent dispense capability
- Long work life
- High throughput
- Box oven cure
<3X3 Ag, PPF or Au L1 260°C capable 2.0X10 -4 2.5 1 hr. at 175°C
Loctite Ablestik 8600 Ag-filled, acrylate die attach adhesive - Low stress
- Excellent in package thermal performance
- Oven or snap cure
<5X5 Cu, Ag, PPF or Au L1 260°C capable 1.0X10 -3 >4 60 sec. to peak 220°C (snap)
Loctite Ablestik ABP 8060T Ag-filled, BMI hybrid die attach adhesive - High modulus
- High die shear strength
- Hydrophobic
- Oven cure  
<2X2 Cu, Ag, PPF or Au L2 260°C capable 2.5X10 -5 20 45 min. ramp and 60 min. hold at 200°C
Loctite Ablestik ABP 8064T Ag-filled, die attach adhesive - Medium modulus
- Low outgassing
- Oven cure
3X3 to 8X8 Cu, Ag, PPF or Au L1 260°C capable 2.0X10 -5 22 60 min. ramp and 60 min. hold at 180°C
Loctite Ablestik ABP 8065T Ag-filled, epoxy Hybrid die attach adhesive - No channel void issue
- High die shear strength
- Dispensable silver paste
- Oven or snap cure
<2X2 Ag or Au L3 260°C capable 3.0X10 -5 10 30 min. ramp and 60 min. hold at 185
°C in nitrogen (oven)
Loctite Ablestik ABP 8066T Ag-filled, die attach adhesive - Long open time
- High die shear strength
- Hydrophobic
- Low outgassing
- Oven cure
<5X5 Cu, Ag, PPF or Au L1 260°C capable 4.0X10 -5 15 30 min. ramp and 60 min. hold at 175°C
Loctite Ablestik FS 849-TI Ag-filled, die attach adhesive - Excellent in package thermal performance
- Low bleed
- Medium modulus
- Low outgassing
- Oven cure
<8X8 Ag or Au L2 260°C capable 2.0X10 -5 7.8 15 min. ramp and 30 min. hold at 175°C
Loctite Ablestik QMI519 Ag-filled, BMI/acrylate die attach adhesive - Excellent dispense capability
- Long work life
- High throughput
- Hydrophobic
- Fast oven cure or SkipCure
<5X5 Cu, Ag, PPF or Au L1 260°C capable 1.0X10 -4 3.8 >10 sec. at 200°C (SkipCure)
Loctite Ablestik QMI529HT-LV Ag-filled, BMI hybrid die attach adhesive - Good dispensing characteristics
- Stable at high temperatures
- Hydrophobic
- Excellent adhesive strength
- Oven cure
<8X8 Ag or PPF L2 260°C capable 5.0X10 -5 8 30 min. ramp and 60 min. hold at 175°C
Loctite Ablestik SSP 2020 Ag sintering die attach adhesive - High die shear strength
- Robust dispense and stencil print performance
- Good workability
- High temperature sinter with or without pressure
<3X3 Ag or Au L3 260°C capable 4.8X10 -5 >100 10 min. ramp and 60 min. hold at 250°C (pressureless sintering)
 
Electrically conductive die attach film (CDAF) adhesives
Product Description Key attributes Film thickness (um) Moisture sensitivity level, MSL Thermal conductivity (W/m-k) In-package thermal resistance (K/W)
Loctite Ablestik CDF 200P Series Ag-filled die attach adhesive - Suitable for small die
- Recommended for thin wafer handling applications
- Oven cure
15 or 30 L1 260°C capable 2.3 1.5
Loctite Ablestik CDF 300P Series Ag-filled die attach adhesive - Suitable for small die
- High adhesion
- Good wetting
- Oven cure
15 or 30 L1 260°C capable 1.0 2.1
Loctite Ablestik CDF 500P Series Ag-filled die attach adhesive - Good wetting and low warpage for large die
- Recommended for thin wafer handling applications
- Oven cure
15 or 30 L1 260°C capable 1.5 1.4
Loctite Ablestik CDF 600P Series Ag-filled die attach adhesive - Low stress and excellent wetting for large die
- Compatible with various metal surfaces, including solder
- Recommended for thin wafer handling applications
- Oven cure
25 L2 260°C capable 1.0 2.1
Loctite Ablestik CDF 700P Series Ag-filled die attach adhesive - Suitable for small and medium die
- High adhesion
- Oven cure
15 or 30 L1 260°C capable 5.5 0.7
Loctite Ablestik CDF 800P Series Ag-filled die attach adhesive - Suitable for small die
- Recommended for thin wafer handling applications
- Oven cure
15 L1 260°C capable 3.4 0.7
 
Electrically Conductive Wafer Backside Coating (WBC) Adhesives
Product Description Key attributes Die size (mm) Substrate finish Moisture sensitivity level, MSL Volume resistivity (Ohm-cm) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 8008 Ag-filled, die attach wafer backside coating adhesive - Excellent stencil printing and low surfaces roughness
- Viod-free bondline without bleed
- Oven B-stage and snap or oven cure
<3X3 Cu, Ag or PPF L1 260°C capable 1.0X10-4 2.2 60 sec. at 230°C (snap)
Loctite Ablestik 8008HT Ag-filled, die attach wafer backside coating adhesive - Applied by stencil printing
- Viod-free bondline without bleed
- Oven B-stage and snap or oven cure
<1X1 Cu, Ag or PPF L1 260°C capable 6.0X10-5 11.0 20 sec. at 170°C (snap)
Loctite Ablestik 8008MD Ag-filled, die attach wafer backside coating adhesive - Applied by stencil printing
- Low stress
- Good substrate wetting
- Oven B-stage and snap or oven cure
<4X4 Cu, Ag or PPF L1 260°C capable 5.0X10-4 6.0 10 min. ramp and 60 min. hold at 115°C
 

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Die Attach Adhesives